ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,758, issued on April 14, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip packaging apparatus and preparation method... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stiffeners around indivi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,759, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stiffeners around indivi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,760, issued on April 14, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module and method for manufacturing semi... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,761, issued on April 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "LED display panel and display device with... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,761, issued on April 14, was assigned to Shanghai Tianma Micro-electronics Co. Ltd. (Shanghai). "LED display panel and display device with... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,762, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Methods and apparatus to reduce thickness of on-package memor... Read More